Specialize in micro/nano cutting, precision drilling, and grooving of semiconductor ceramic substrates, ceramic packaging bases, and high-frequency ceramic components; these processes are used for semiconductor component R&D, sample preparation, and small-batch precision prototyping, meeting the high-cleanliness, high-precision, and zero-damage processing requirements of the semiconductor industry.Product
National-level Semiconductor Materials Research Institute
The equipment enables cold processing of semiconductor ceramic materials, effectively avoiding thermal stress cracking and surface damage, and the processing tolerance is stably controlled at the micron level; it successfully meets the R&D and trial production needs of semiconductor precision components, greatly improving the R&D efficiency and sample yield of new semiconductor ceramic devices in the institute, and the equipment's precision and stability have reached the high-end standards of scientific research in the industry.
1 unit/A custom-designed semiconductor-specific ceramic laser cutting machine will be deployed to support the research institute's precision machining experimental production line.Quantity
2+ years (stable operation)Duration