laser processing services

Name: "laser processing services"
Rating: 5 (48 reviews)

SKU: 063517426X

Model: Custom‑laser‑service‑01

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Product Details

Product Specification

Type	Precision ceramic laser cutting service, laser ablation & micro‑processing service	Model	Custom‑laser‑service‑01
Params	Supported material thickness: 0.05‑11 mm; Stable mass‑production thickness: ≤6 mm; Positioning accuracy: ±0.005 mm; Kerf width: 0.02‑0.15 mm; Hour‑based chargin(20-30usd/h); No minimum order quantity	Material	Alumina ceramics, aluminum nitride (AlN), silicon carbide (SiC), silicon nitride, glass, ferrite, semiconductor-related materials, metals, PCB substrates, and various hard and brittle materials.
Applicable Industry	3C Electronics PCB Industry Semiconductor Packaging Precision Electronic Components New Energy Medical Devices Aerospace Industry New Energy Vehicles Specialty Ceramics Lithium Battery Industry Solar Photovoltaics Motor Industry

Feature

upport sample & small‑batch & mass production; Multiple logistics options: courier /land transport /sea freight; High‑precision non‑contact laser processing; Low micro‑crack & low chipping; Fast sample turnaround; Accept custom‑specified processing requirements