About WINTIME

WINTIME Semiconductor was established in 2020, integrating the research, development, production, and sales of high-precisionfer-level cutting blades. It provides customers with solutions for the entire process of high-precision cutting, helping to improve cutting quality and reduce production costs. It is recognized many leading enterprises at home and abroad as a supplier of high-precision cutting blades, cutting tapes, and cutting solutions. In 2023, nantong wintime Semiconductor Special Materials Project had a total investment of nearly tens of millions of yuan, with a new factory and auxiliary buildings of 34,00 square meters, and an annual production capacity of more than 1 million pieces of dicing blades, ranking in the forefront of the country. It has 2 patent technologies and has won many awards in national, provincial, and municipal science and technology competitions and entrepreneurship competitions. The company's completed "Ultra-thin Wafer D Blade" project has achieved a thickness of less than 9 microns in the process, and the product quality has reached the international cutting-edge level. It is of the few domestic companies that can achieve mass production. As a domestic self-developed project, we carry out the domestic substitution of high-end industries on the basis of advanced technology.
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World-Class Team
Graduates from top universities worldwide
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Advanced R&D
Self-developed
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Innovation Focus
Multiple innovative technologies

Our Products

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Sawing Blade

Sawing Blade

Model: SB-001
Parameters: 0932490867

Dicing Blade

Dicing Blade

Model: DB-001
Parameters: 1353562808

DZY Series Precision Diamond Dicing Blade for Wafer Cutting

DZY Series Precision Diamond Dicing Blade for Wafer Cutting

Model: SB-001
Parameters: 0529338394

DZR-S Series Slotted Diamond Slicing Blade for High-Speed Dicing

DZR-S Series Slotted Diamond Slicing Blade for High-Speed Dicing

Model: SB-001
Parameters: 6761401208

SZ Series Resin Bond Diamond Dicing Blade for Brittle Materials

SZ Series Resin Bond Diamond Dicing Blade for Brittle Materials

Model: SB-001
Parameters: 2015228888

JS Series Metal Bond Diamond Dicing Blade for Hard Materials

JS Series Metal Bond Diamond Dicing Blade for Hard Materials

Model: SB-001
Parameters: 5883023932

DZY Series Ultra-Thin Wafer Dicing Blade ≤9μm for Semiconductor Cutting

DZY Series Ultra-Thin Wafer Dicing Blade ≤9μm for Semiconductor Cutting

Model: DB-001
Parameters: 4058107413

JS Series Metal Bond Dicing Blade for Precision Semiconductor Dicing

JS Series Metal Bond Dicing Blade for Precision Semiconductor Dicing

Model: DB-001
Parameters: 9556171290

SZ Series Resin Bond Dicing Blade for Low-Stress Wafer Slicing

SZ Series Resin Bond Dicing Blade for Low-Stress Wafer Slicing

Model: DB-001
Parameters: 9806757319

DZR-S Series Slotted Slicing Dicing Blade for Hard Materials

DZR-S Series Slotted Slicing Dicing Blade for Hard Materials

Model: DB-001
Parameters: 8847798418

Company Gallery

WINTIME Workshop
WINTIME Workshop
WINTIME Workshop
WINTIME Workshop
WINTIME Workshop
WINTIME Workshop
WINTIME Workshop
WINTIME Workshop
WINTIME Office Area
WINTIME Office Area
WINTIME Office Area
WINTIME Office Area
WINTIME Workshop
WINTIME Workshop
WINTIME Workshop
WINTIME Workshop
WINTIME Office Area
WINTIME Office Area
WINTIME Office Area
WINTIME Office Area
WINTIME Building
WINTIME Building

Success Stories & Case Studies

Semiconductor Packaging Factory

Semiconductor Packaging Factory

Cutting chipping rate ≤5μm, wafer yield increased by 12%, stable mass production without blade replacement
Ultra-thin thickness ≤9μm, narrow kerf, low material loss, long service life

Location: CN 📦 Quantity: 500,000+ pieces annual usage, mass production line matching

Company & Product Videos

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Company Introduction & Factory Tour

⏱ Duration: 3:45 | 👁 Views: 15,230

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Product Demonstration - Kestrel K-1

⏱ Duration: 5:12 | 👁 Views: 28,450

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Technology Innovation Showcase

⏱ Duration: 4:30 | 👁 Views: 12,890

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Customer Testimonials & Success Stories

⏱ Duration: 6:20 | 👁 Views: 9,650

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