Compact Liquid-to-Liquid Thermal Shock Test Chamber EYC603S2 for PCB and Semiconductor Reliability Testing

Name: "Compact Liquid-to-Liquid Thermal Shock Test Chamber EYC603S2 for PCB and Semiconductor Reliability Testing"
Rating: 5 (543 reviews)

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SKU: 5939378870

Model: EYC603S2, EYC605S2

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Product Details

Product Summary

The EYC603S2 is a compact liquid-to-liquid thermal shock test chamber engineered for rapid temperature cycling of small components. With a test volume of 2.6 liters, it facilitates stringent reliability testing for PCB assemblies and semiconductor devices. The automatic mechanical suspension transfer system ensures fast and repeatable temperature transitions between high-temperature and low-temperature fluid baths, with a transfer time of less than 10 seconds and recovery time under 5 minutes.

Key Selling Points

Fast Temperature Transfer: Transfer time less than 10 seconds, enabling rapid thermal shock cycles to meet MIL-STD and IEC test methods.
Precise Temperature Control: Temperature stability within ±0.5°C and uniformity ≤2.0°C, ensuring consistent test conditions across the specimen basket.
Compact Design: The 2.6L test volume and specimen basket size of 120×120×180mm make it ideal for small electronic components, saving lab space.
Automated Operation: Programmable cycles with 32-bit color screen control, Ethernet and USB data access, and APP remote management.
Robust Safety Features: Equipped with overload, overheat, overpressure protection, and power-off memory with auto-resume for unattended testing.

Technical Specifications

Model	EYC603S2
Test Volume	2.6 L
High Temp Bath Range	+70°C to +150°C
Low Temp Bath Range	-65°C to 0°C
Temp Fluctuation	≤±0.5°C
Temp Uniformity	≤2.0°C
Temp Deviation	≤±2.0°C
Preheating Range	+70°C to +200°C
Pre-cooling Range	-70°C to 0°C
Transfer Time	<10 sec
Recovery Time	<5 min
Specimen Basket Size	120×120×180 mm
Liquid Bath Internal Dims	250×350×400 mm
External Dimensions	1000×1750×1910 mm
Power Supply	AC380V ±10%, 50Hz, 3-phase
Cooling Method	Water-cooled

Models and Options

This variant is specifically configured for compact testing needs. For larger testing volumes, consider the EYC605S2 model. Customization options include specimen basket size and specialized fixturing.

Materials and Structure

Inner chamber is constructed from SS304 stainless steel, providing corrosion resistance against fluorocarbon oil. Outer casing is powder-coated carbon steel, offering durability and easy maintenance. The system includes a high-temperature liquid bath, low-temperature liquid bath, and cold air chamber with automatic mechanical suspension transfer mechanism.

Applications

Ideal for reliability testing of PCB assemblies, semiconductor devices, BGA electronic components, and small electronic modules. Widely used in industries including automotive electronics, aerospace, new energy, military, and consumer electronics.

Customization

Offers customization for specimen basket dimensions, test parameters, and interface options. Factory calibration and acceptance testing available to meet specific requirements.

FAQ

Q: What is the minimum order quantity?

MOQ is 1 unit, with customized single-unit orders accepted.

Q: How fast is the temperature transfer?

The transfer time is less than 10 seconds, ensuring rapid thermal shock cycling.

Q: Can I monitor the test remotely?

Yes, the chamber supports APP remote management and network video monitoring.

Q: What safety features are included?

Overload, overheat, and overpressure protections are standard, along with power-off memory and auto-resume.

Q: What is the warranty period?

Standard warranty covers 12 months; extended warranty options are available.

Q: How is the unit shipped?

We offer FOB, CIF, EXW, and DDP; sea, air, and land freight are supported.

Inquiry Information

For pricing and lead time, please contact: Email: info@envsin.com. Phone/WhatsApp: +86 15013523936.