SZ Series Resin Bond Diamond Dicing Blade

Product Summary

The SZ Series utilizes a resin bond matrix that provides a soft cutting action, ideal for brittle materials like silicon wafers and glass. Thickness range 8-50μm with ±0.002mm accuracy ensures minimal chipping. Compatible with high-speed dicing saws up to 60000rpm.

Key Selling Points

• Low Chipping: Resin bond absorbs shock, reducing edge chipping on brittle substrates.
• Ultra-Thin Kerf: Down to 8μm thickness saves material and increases die per wafer.
• Precision Accuracy: ±0.002mm cutting tolerance for consistent die size.
• Wide Application: Suitable for silicon, gallium arsenide, sapphire, and ceramic.

Technical Specifications

Models and Options

Standard diameters: 58mm, 76mm, 102mm. Bore sizes: 25.4mm, 40mm, 50.8mm. Custom dimensions available.

Materials and Structure

Resin bond (phenolic or polyimide) with diamond grains uniformly dispersed. The exposed diamond provides efficient cutting while the resin matrix wears controllably.

Applications

• Silicon wafer dicing
• Glass and quartz cutting
• Ceramic substrate dicing
• LED sapphire wafer dicing

Customization

Custom blade thickness, bond hardness, and diamond concentration available. MOQ for standard: 100 pcs; custom: 500 pcs.

FAQ

1. What is the recommended feed rate for 200mm silicon wafers?

We recommend 2-5 mm/s with spindle speed 30000-40000 rpm for optimal quality.

2. Can these blades be used for printed circuit boards (PCBs)?

Yes, but for PCB we suggest metal bond version (JS series) for longer life.

3. How often do you need to dress the blade?

Dressing frequency depends on usage; typically every 5000 cuts or when cut quality degrades.

4. Do you offer blades for wet or dry cutting?

Our blades are designed for wet cutting; dry cutting may reduce life.

5. What is the shelf life of resin bond blades?

18 months when stored in dry, cool conditions.

Inquiry Information

For orders and inquiries:
Email: shenxiangfei@ntwintime.com
Tel: +86 13851530812
Whatsapp: +8618888053207