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Our semiconductor rigid felt is a purified carbon fiber composite insulation board, specifically engineered for silicon and silicon carbide crystal growth processes. It delivers ultra-low ash content (≤5 ppm), reliable thermal insulation, and high-temperature stability up to 2500°C, ensuring process purity and energy efficiency.
| Material | Carbon Fiber Composite |
| Type | Purified PAN-based / Rayon-based Carbon Rigid Board |
| Purification Purity | Ash content ≤20 ppm (Ultra grade ≤5 ppm) |
| Thermal Conductivity | 0.15 - 0.35 W/m·K at 1500°C |
| Bulk Density | 0.18 - 0.24 g/cm³ |
| Processing Temp | Up to 2500°C in inert vacuum |
Made from carbon fiber composite with a rigid board structure, available in PAN-based or Rayon-based precursors, purified to achieve ultra-low ash levels.
We offer custom sizes, shapes, and purification levels. Please contact us with your specific requirements.
Up to 2500°C in inert vacuum.
Standard grade ≤20 ppm, ultra grade ≤5 ppm.
0.15 - 0.35 W/m·K.
0.18 - 0.24 g/cm³.
Carbon fiber composite, PAN or rayon based.
Yes, customization is available.
1 unit.
New customers: 100% T/T in advance; long-term cooperation: 70% T/T advance, 30% before shipment.
For inquiries or orders, please contact:
Filename: ultra-low-ash-semiconductor-rigid-felt.png
Alt: Ultra-low ash semiconductor rigid felt with pyrolytic carbon coating
