SZ Series Resin Bond Dicing Blade for Low-Stress Wafer Slicing

Name: "SZ Series Resin Bond Dicing Blade for Low-Stress Wafer Slicing"
Rating: 5 (734 reviews)

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SKU: 9806757319

Model: DB-001

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Product Details

SZ Series Resin Bond Dicing Blade

Product Summary

The SZ series resin bond dicing blade is designed for low-stress, high-precision cutting of fragile materials such as semiconductor wafers, optical glass, and functional ceramics. The resin bond offers a softer cutting action, reducing chipping and subsurface damage, ideal for thin and delicate substrates.

Key Selling Points

Resin Bond Matrix: Provides a flexible, shock-absorbing cut that minimizes chipping and cracks on fragile materials.
Diamond Abrasive Grains: Delivers precise cutting edges with consistent quality.
Low Cutting Stress: Reduces mechanical stress on the workpiece, improving yield for thin wafers.
High Cutting Efficiency: Optimized for dry and wet cutting processes in automatic dicing machines.
Annual Capacity Over 1M Pieces: Ensures supply continuity for large-scale production.

Technical Specifications

Parameter	Value
Bond Type	Resin bond
Abrasive Material	Diamond
Thickness Range	Customizable (typically 20-50μm)
Cutting Mode	Dry/Wet
Annual Production Capacity	Over 1 million pieces

Models and Options

Standard and customized models available. MOQ: 100 pieces (standard), 500 pieces (customized). Trial orders negotiable.

Materials and Structure

The resin bond matrix holds diamond grains in a resilient polymer, providing excellent surface finish and reduced cutting forces. Suitable for applications where damage to the workpiece must be minimized.

Applications

Semiconductor wafer dicing (thin wafers)
Optical communication device cutting
Functional ceramics components
New functional material slicing
Glass and quartz dicing

Customization

We can adjust bond hardness, grain size, and blade dimensions to match specific materials and cutting speeds. Contact our technical team.

FAQ

Q1: What is the advantage of resin bond over metal bond?
A: Resin bond provides a softer cut, reducing chipping and stress on fragile materials, ideal for thin wafers and optical components.

Q2: Can the SZ blade be used for ultra-thin wafer cutting?
A: Yes, it is designed to minimize stress and damage, suitable for ultra-thin wafers.

Q3: What is the MOQ for standard SZ models?
A: 100 pieces for standard models; 500 for customized.

Q4: Is testing provided before shipment?
A: Yes, pre-shipment testing and third-party inspection are available.

Q5: What payment terms do you accept?
A: 30/70 terms (30% deposit, 70% before shipment).

Q6: Can I get a free sample?
A: Small-batch trial orders are available with flexible pricing. Please contact us.

Q7: How long does delivery take?
A: Lead time depends on order quantity and customization. Standard orders typically ship within 2-4 weeks.

Inquiry Information

Email: shenxiangfei@ntwintime.com
Tel: +86 13851530812
WhatsApp: +8618888053207

Image

SZ Series Resin dicing blade top view