WINTIME Semiconductor was established in 2020, integrating the research, development, production, and sales of high-precisionfer-level cutting blades. It provides customers with solutions for the entire process of high-precision cutting, helping to improve cutting quality and reduce production costs. It is recognized many leading enterprises at home and abroad as a supplier of high-precision cutting blades, cutting tapes, and cutting solutions. In 2023, nantong wintime Semiconductor Special Materials Project had a total investment of nearly tens of millions of yuan, with a new factory and auxiliary buildings of 34,00 square meters, and an annual production capacity of more than 1 million pieces of dicing blades, ranking in the forefront of the country. It has 2 patent technologies and has won many awards in national, provincial, and municipal science and technology competitions and entrepreneurship competitions. The company's completed "Ultra-thin Wafer D Blade" project has achieved a thickness of less than 9 microns in the process, and the product quality has reached the international cutting-edge level. It is of the few domestic companies that can achieve mass production. As a domestic self-developed project, we carry out the domestic substitution of high-end industries on the basis of advanced technology.

WINTIME Semiconductor was established in 2020, integrating the research, development, production, and sales of high-precisionfer-level cutting blades. It provides customers with solutions for the entire process of high-precision cutting, helping to improve cutting quality and reduce production costs. It is recognized many leading enterprises at home and abroad as a supplier of high-precision cutting blades, cutting tapes, and cutting solutions. In 2023, nantong wintime Semiconductor Special Materials Project had a total investment of nearly tens of millions of yuan, with a new factory and auxiliary buildings of 34,00 square meters, and an annual production capacity of more than 1 million pieces of dicing blades, ranking in the forefront of the country. It has 2 patent technologies and has won many awards in national, provincial, and municipal science and technology competitions and entrepreneurship competitions. The company's completed "Ultra-thin Wafer D Blade" project has achieved a thickness of less than 9 microns in the process, and the product quality has reached the international cutting-edge level. It is of the few domestic companies that can achieve mass production. As a domestic self-developed project, we carry out the domestic substitution of high-end industries on the basis of advanced technology.

WINTIME Semiconductor was established in 2020, integrating the research, development, production, and sales of high-precisionfer-level cutting blades. It provides customers with solutions for the entire process of high-precision cutting, helping to improve cutting quality and reduce production costs. It is recognized many leading enterprises at home and abroad as a supplier of high-precision cutting blades, cutting tapes, and cutting solutions. In 2023, nantong wintime Semiconductor Special Materials Project had a total investment of nearly tens of millions of yuan, with a new factory and auxiliary buildings of 34,00 square meters, and an annual production capacity of more than 1 million pieces of dicing blades, ranking in the forefront of the country. It has 2 patent technologies and has won many awards in national, provincial, and municipal science and technology competitions and entrepreneurship competitions. The company's completed "Ultra-thin Wafer D Blade" project has achieved a thickness of less than 9 microns in the process, and the product quality has reached the international cutting-edge level. It is of the few domestic companies that can achieve mass production. As a domestic self-developed project, we carry out the domestic substitution of high-end industries on the basis of advanced technology.